NORA-W30 series - System integration manual
UBX-22021119 - R02
Module integration
Page 17 of 52
C1-Public
2.9.5
Universal Serial Interface (USI)
NORA-W30 modules have up to one USI. The USI can be used as a high-speed I2C, UART, or SPI
interface
–
in addition other high-speed communications interfaces listed above. See also
Serial Peripheral Interface (SPI)
, and
Universal Asynchronous Receiver Transmitter
2.10
Digital interfaces
NORA-W30 modules have 20 I/O pins. The pins can be assigned to the digital interfaces listed below;
however, assignments cannot be in conflict. To visualize the available pin assignments for the
interfaces, see the
2.10.1
Pulse Width Modulation (PWM)
NORA-W30 modules support up to 18 PWM outputs. There are 12 high-speed outputs
–
HS_PWM[0,1,4..7,10..15]
–
and 6 low-power outputs
–
LP_PWM[0..5]
.The PWM module enables the
generation of pulse width modulated signals on GPIO. The module implements 16-bit up counters that
drive assigned GPIOs.
2.10.2
Key-scan
NORA-W30 modules support a keypad interface, consisting of up to 5 row x 2 column or 4 row x 3
column matrices. The key-scan can be used to wake NORA-W30 from deep-sleep.
2.10.3
Quadrature Decoder (Q-Decoder or QDEC)
NORA-W30 modules have up to one Q-Decoder to determine the position and speed of a rotary device.
The interface consists of the following signals
–
IDX
,
PHA
, and
PHB
.
2.11
Analog
NORA-W30 modules have up to three analog inputs
–
ADC_4
,
ADC_5
, and
ADC_6
. The pins
assignments cannot be in conflict with data and digital interfaces. To visualize the available pin
assignments for the interfaces, see
2.12
Debug
NORA-W30 series uses the Arm® Serial Wire Debug (SWD) interface
–
SWD_DATA
and
SWD_CLK
–
for programming and debugging both cores of the Realtek RTL8720DF within the module.
2.13
No-connect pins (n/c)
Do not connect
n/c
pins. No-Connect pins are allocated for future interfaces and functionality.
2.14
Ground (GND) pins
Good electrical connection of all module GND pins, using solid ground layer of the host application
board, is required for correct RF performance. Firm connections provide a thermal heat sink for the
module and significantly reduce EMC issues.
