Features
MSC8144E Reference Manual, Rev. 3
Freescale Semiconductor
1-3
StarCore SC3400
DSP Core
Each high-performance core is binary compatible with the SC140 core used in the MSC81xx DSP
family and the SC1400 core used in the MSC711x DSP family and delivers up to 3200/4000 16-bit
MMACS using an internal 800 MHz/1 GHz clock at 1 V. Each core includes:
•
Data arithmetic and logic unit (DALU) containing 4 ALUs.
•
Address generation unit (AGU) containing two address arithmetic units.
•
Up to six instructions execute in a single clock cycle.
•
Variable-length execution set (VLES) that can be optimized for code density and performance.
•
16 data registers, 40 bits each.
•
27 address registers, 32 bits each.
•
Hardware support for fractional and integer data types.
•
Four hardware loops with zero overhead.
•
Very rich 16-bit wide orthogonal instruction set.
•
Application-specific instructions for Viterbi and multimedia processing.
•
Special single instruction, multiple data (SIMD) instructions working on 2-word or 4-byte operands
packed in a register. Can perform 2 to 4 operations per instruction (8 to 16 operations per VLES).
The SIMD instruction supports 2
×
8-bit multiply and 20-bit accumulate operation.
•
Dynamic interlocking for friendlier programming and more efficient compiler support.
•
User and supervisor privilege levels supporting a protected software model.
•
Precise memory access exceptions enables good RTOS support and soft error corrections.
•
Branch target buffer (BTB) accelerates change-of-flow operations.
Chip-Level
Arbitration and
Switching System
(CLASS)
•
A full fabric that arbitrates between the DSP cores and other CLASS initiators to the shared M2
memory, M3 memory, PCI, DDR SDRAM controller, and the device configuration control and
status registers (CCSRs).
•
High bandwidth.
•
Non-blocking allows parallel accesses from multiple initiators to multiple targets.
•
Fully pipelined.
•
Low latency.
•
Per target arbitration highly optimized to the target characteristics using prioritized round-robin
arbitration.
•
Reduces data flow bottlenecks and enables high-bandwidth internal data transfers.
Internal Memory
The 10.96 MB internal memory space total includes:
•
16 KB ICache per core.
•
32 KB DCache per core.
•
128 KB L2 shared ICache.
•
512 KB M2 low-latency memory for critical data and temporary data buffering. Accessible from all
DSP subsystems and all CLASS initiators via four interleaved ports. The memory is volatile after
reset.
•
10 MB 128-bit wide M3 memory accessed at up to 400 MHz. Accessible from all DSP subsystems
and all CLASS initiators. Most applications run with no external memory.
•
96 KB of boot ROM accessible from the cores.
M2 Memory
•
512 KB of low latency SRAM that is volatile after reset.
•
Runs at up to 400 MHz.
•
Four address-interleaved banks.
•
128-bit wide port per bank.
•
Up to four simultaneously accesses.
•
Burstable access support.
M3 Memory
•
128-bit wide port.
•
Runs at up to 400 MHz.
•
10 MB of memory.
•
A variety of applications can run without the need for external memory.
•
Hidden refresh with low probability of conflict with core accesses.
•
Burstable accesses.
L2 Cache
•
L2 shared ICache.
•
128 KB of memory organized in two interleaved banks of 64 KB each.
•
Banks can have simultaneous access.
•
8-way set associative.
•
Pass-through port for L2 non-cacheable instructions.
•
Optimized to accelerate core code execution from M3 memory and DDR memory.
Table 1-1. MSC8144E Features (Continued)
Feature
Description
Summary of Contents for MSC8144E
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